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Liandian Singapore Wafer Factory
Project

Liandian Singapore Wafer Factory

79647a28-0237-40e0-900a-d4eee2307eaa
• Products: H-Beam S355J0
• Supplier: XINYONGYUAN(SHANDONG)STEEL SALES CO., LTD
• Quantity: 800 tons
• Project location: Singapore
• Date: 2022
Project Introduction

As a world-leading semiconductor foundry, UMC provides high-quality integrated circuit (IC) fabrication services, focusing on logic and various specialty technologies to serve all major sectors of the electronics industry.
UMC announced in February 2022 that they had approved a plan to build a new advanced manufacturing facility next to its 300mm wafer fab in Singapore,which will be one of the most advanced semiconductor foundries in the country, producing UMC's 22/28nm processes. The planned investment will reach $5 billion. Driven by the robust demand for a 5G network, IoT, and automotive mega-trends in the next future, the company expects the new fab to play a critical role in satisfying growing demand in these emerging sectors, while helping to alleviate the structural shortage of foundry capacity, especially on 22/28nm processes. The 1,110 tons of H-Beam supplied by XINYONGYUAN METAL will be used in this future pointed facility.

As the most popular material on construction sites worldwide, H-Beam is used to support large buildings due to their high strength and durability properties, and the batch of S355J0 H-Beam is especially suitable for this project.